
© Apple
Przemysł elektroniczny |
Lista dostawców Apple’a
Apple wyszczególniło 200 przedsiębiorstw odpowiadających za przynajmniej 97% wydatków na materiały i usługi produkcji i montażu dla amerykańskiej spółki.
Apple opublikowało tegoroczną listę firm, które dostarczają usługi i produkty na potrzeby producenta iPhone’ów. Oto ona:
3M Co. | Nan Ya Plastics Corp. |
AAC Technologies Holdings Inc. | NEC TOKIN Corp. |
Acbel Polytech Inc. | Nichia Corp. |
Advanced Semiconductor Engineering Inc. | Nidec Corp. |
AKM Semiconductor Inc. | Nippon Mektron Ltd. |
Alps Electric Co. Ltd. | Nissha Printing Co. Ltd. |
Amphenol Corp. | Nitto Denko Corp. |
Analog Devices Inc. | NXP Semiconductors N.V. |
Artesyn Embedded Technologies | OMRON Precision Technology Co. Ltd. |
Asahi Glass Co Ltd. | OSRAM Opto Semiconductor GmbH |
Asia Vital Components Ltd. | Panasonic Corp. |
AT&S | PCH International |
AU Optronics Corp. | Pegatron Corp. |
Austria Microsystems (AMS AG) | Pioneer Material Precision Tech |
Avago Technologies Ltd. | Polymatech Co. Ltd. |
Biel Crystal Manufactory Ltd. | Prent Corp. |
Brilliant International Group Ltd. | Primax Electronics Ltd. |
Broadway Industrial Group Ltd. | Quadrant Solutions |
Bumchun Precision Company Ltd. | Quanta Computer Inc. |
BYD Company Ltd. | Radiant Opto Electronics Corp. |
Career Technology (Mfg.) Co. Ltd. | Renesas Electronics Corp. |
Catcher Technology Co. Ltd. | RF Micro Devices Inc. |
Cathay Tat Ming Precision Metal Products Co. Ltd. | Robert Bosch GmbH |
Cheng Loong Corp. | ROHM Co. Ltd. |
Cheng Uei Precision Industry Co. Ltd. (Foxlink) | RR Donnelley & Sons Co. |
China Circuit Technology Corp. | SABIC Innovative Plastics |
China Jinlong Holding Group | Salcomp Co. Ltd. |
CN Innovations Holdings Ltd. | Samsung Electro-Mechanics Co. Ltd. |
Coilcraft Inc. | Samsung Electronics Co. |
Compeq Manufacturing Co. Ltd. | Samsung SDI. Co. Ltd. |
Coretronic Corp. | Sandisk Corp. |
Corning Inc. | Seagate Technology LLC |
Cosmosupplylab Ltd. | Seiko Epson Corp. |
Cowell E Holdings Inc. | Semiconductor Components Industries LLC |
Coxon Precise Industrial Co. Ltd. | Sharp Corp. |
CymMetrik Enterprise Co. Ltd. | Shenzhen Desay Battery Technology Co. Ltd. |
Daikin Industries Ltd. | Shin Zu Shing Co. Ltd. |
Darfon Electronics Corp. | Simplo Technology Co. Ltd. |
Delta Group Diodes Inc. | SK Hynix Inc. |
DSM Engineering Plastics Co. Ltd. | Skyworks Solutions Inc. |
Dynacast International Inc. | Solvay Specialty Polymers |
Dynapack International Technology Corp. | Sony Corp. |
E-Litecom Co. Ltd. | STANLEY Engineered Fastening |
Eaton | STMicroelectronics NV |
ECCO Leather B.V. | Styron LLC |
Ellington Electronics Technology Group | Sumida Corp. |
Evergreen Screws Group | Sumitomo Chemical Co. Ltd. |
Fairchild Semiconductor International | Sumitomo Electric Industries Ltd. |
Fastway Creation | Sunon Electronics Co. Ltd. |
Flexium Interconnect Inc. | Sunrex Technology Corp. |
Flextronics Sales and Marketing (A-P) Ltd. | Suyin Electronic Corp. |
Fortune Grand Enterprise Co. Ltd. | Suzhou Anjie Technology Co. Ltd. |
Foster Electric Co. Ltd | Swiftronic Pte. Ltd. |
Foxconn Interconnect Technology (FIT) | Tighten City Kam Kiu Aluminium Extrusion Co. Ltd. |
Fujikura Ltd. | Taiwan Powder Technologies (TPT) |
Furukawa | Taiwan Semiconductor Manufacturing Co. Ltd. ( TSMC) |
Genius Electronic Optical Co. Ltd. | Taiyi Group |
GoerTek Inc. | Taiyo Yuden Co. Ltd. |
Gruppo Dani S.P.A. | Taylor Corp. |
Hama Naka Shoukin Industry Co. Ltd. | TDK Epcos Corp. |
Hanson Metal Factory Ltd. | TE Connectivity Ltd.-Tyco |
Heesung Electronics Ltd. | Teikoku Printing Inks Mfg. Co. Ltd. |
Henkel Corporation | Texas Instruments Inc. |
Heptagon Advanced Micro-Optics Pte Ltd. | Toshiba Corp. |
HI-P International Ltd. | Tianjin Lishen Battery Joint-Stock Co. Ltd. |
Hirose Electric Co. Ltd. | Toyo Rikagaku Kenkyusho Co. Ltd. |
Hon Hai Precision Industry Co. Ltd. (Foxconn) | Toyoda Gosei Co. Ltd. |
IBIDEN Co. Ltd. | TPK Holding Co. Ltd. |
Infineon Technologies AG | Tripod Technology Corp. |
Intel Corp. | TriQuint Semiconductor Inc. |
Interflex Co. Ltd. | Triumph Lead Group Ltd. |
Intramedia Inc. | Tsujiden Co. Ltd. |
Inventec Corp. | TTM Technologies Inc. |
Jabil Circuit Inc. | Unimicron Technology Corp. |
Japan Aviation Electronics Industry Ltd. | UACJ Corp. |
Japan Display Inc. | Unisteel Technology Ltd. |
Jarllytec Co. Ltd. | Unitech Printed Circuit Board Corp. |
Knowles Corp. | Vishay Intertechnology Inc. |
Kyocera Group | Volex Plc |
Laird Technologies | Western Digital Corp. |
Largan Precision Co. Ltd. | Xintec Inc. |
Lateral Solutions Pte Ltd. | Zeniya Aluminum Engineering Ltd. |
Lens One Technology | Zhen Ding Technology Co. Ltd. |
LG Chem Ltd. | |
LG Display Co. Ltd. | |
LG Innotek Co. Ltd. | |
Linear Technology Corp. | Dostawcy fabless: |
Lite-On Technology Corp. | |
Longwell Precision Co. Ltd. | Advanced Micro Devices Inc. |
Luen Fung Group | Broadcom Corp. |
LUXSHARE-ICT | Cirrus Logic Inc. |
Marian Inc. | Dialog Semiconductor GmbH |
Maxim Integrated Products Inc. | Intersil Corp. |
Merry Electronics Co. Ltd. | NVIDIA Corp. |
Micron Technology Inc. | OmniVision Technologies |
Minebea Co. Ltd. | Parade Technologies Ltd. |
Mitsumi Electric Co. Ltd. | Qualcomm Inc. |
Molex Inc. Multi Packaging Solutions Inc. | Silego Technology Inc. |
Multi-Fineline Electronix Inc. | Silicon Works Co. Ltd. |
Murata Manufacturing Co. Ltd. | Synaptics Inc. |